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19-1194; Rev 2; 10/98
KIT ATION EVALU ABLE AVAIL
+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs
General Description ____________________________Features
o +2.7V to +5.5V Single Supply o Low Power: 85A at 50ksps 6A at 1ksps o 8-Channel Single-Ended or 4-Channel Differential Inputs (MAX1110) o 4-Channel Single-Ended or 2-Channel Differential Inputs (MAX1111) o Internal Track/Hold; 50kHz Sampling Rate o Internal 2.048V Reference o SPI/QSPI/MICROWIRE-Compatible Serial Interface o Software-Configurable Unipolar or Bipolar Inputs o Total Unadjusted Error: 1LSB max 0.3LSB typ
MAX1110/MAX1111
The MAX1110/MAX1111 are low-power, 8-bit, 8-channel analog-to-digital converters (ADCs) that feature an internal track/hold, voltage reference, clock, and serial interface. They operate from a single +2.7V to +5.5V supply and consume only 85A while sampling at rates up to 50ksps. The MAX1110's 8 analog inputs and the MAX1111's 4 analog inputs are software-configurable, allowing unipolar/bipolar and single-ended/differential operation. Successive-approximation conversions are performed using either the internal clock or an external serial-interface clock. The full-scale analog input range is determined by the 2.048V internal reference, or by an externally applied reference ranging from 1V to V DD. The 4-wire serial interface is compatible with the SPITM, QSPITM, and MICROWIRETM serial-interface standards. A serial-strobe output provides the end-of-conversion signal for interrupt-driven processors. The MAX1110/MAX1111 have a software-programmable, 2A automatic power-down mode to minimize power consumption. Using power-down, the supply current is reduced to 6A at 1ksps, and only 52A at 10ksps. Power-down can also be controlled using the SHDN input pin. Accessing the serial interface automatically powers up the device. The MAX1110 is available in 20-pin SSOP and DIP packages. The MAX1111 is available in small 16-pin QSOP and DIP packages.
Ordering Information
PART MAX1110CPP MAX1110CAP TEMP. RANGE 0C to +70C 0C to +70C PIN-PACKAGE 20 Plastic DIP 20 SSOP
MAX1110C/D 0C to +70C Dice* *Dice are specified at TA = +25C, DC parameters only.
Ordering Information continued at end of data sheet.
________________Functional Diagram ________________________Applications
Portable Data Logging Hand-Held Measurement Devices Medical Instruments System Diagnostics Solar-Powered Remote Systems 4-20mA-Powered Remote Data-Acquisition Systems
CS SCLK DIN SHDN CH0 CH1 CH2 CH3 CH4* CH5* CH6* CH7* COM INPUT SHIFT REGISTER INT CLOCK CONTROL LOGIC OUTPUT SHIFT REGISTER ANALOG INPUT MUX T/H CLOCK IN 8-BIT SAR ADC OUT REF DOUT SSTRB
VDD DGND
Pin Configurations appear at end of data sheet.
REFOUT REFIN
+2.048V REFERENCE
MAX1110 MAX1111
AGND
SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp.
*MAX1110 ONLY
________________________________________________________________ Maxim Integrated Products
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
ABSOLUTE MAXIMUM RATINGS
VDD to AGND ..............................................................-0.3V to 6V AGND to DGND .......................................................-0.3V to 0.3V CH0-CH7, COM, REFIN, REFOUT to AGND ......................................-0.3V to (VDD + 0.3V) Digital Inputs to DGND ...............................................-0.3V to 6V Digital Outputs to DGND ............................-0.3V to (VDD + 0.3V) Continuous Power Dissipation (TA = +70C) 16 Plastic DIP (derate 10.53mW/C above +70C) ......842mW 16 QSOP (derate 8.30mW/C above +70C) ................667mW 16 CERDIP (derate 10.00mW/C above +70C) ..........800mW 20 Plastic DIP (derate 11.11mW/C above +70C) ......889mW 20 SSOP (derate 8.00mW/C above +70C) ................640mW 20 CERDIP (derate 11.11mW/C above +70C) ..........889mW Operating Temperature Ranges MAX1110C_P/MAX1111C_E................................0C to +70C MAX1110E_P/MAX1111E_E .............................-40C to +85C MAX1110MJP/MAX1111MJE..........................-55C to +125C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10sec) .............................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.5V; unipolar input mode; COM = 0V; fSCLK = 500kHz, external clock (50% duty cycle); 10 clocks/conversion cycle (50ksps); 1F capacitor at REFOUT; TA = TMIN to TMAX; unless otherwise noted.) PARAMETER DC ACCURACY Resolution Relative Accuracy (Note 1) Differential Nonlinearity Offset Error Gain Error (Note 3) Gain Temperature Coefficient Total Unadjusted Error Channel-to-Channel Offset Matching DYNAMIC SPECIFICATIONS (10.034kHz sine-wave input, 2.048Vp-p, 50ksps, 500kHz external clock) Signal-to-Noise and Distortion Ratio Total Harmonic Distortion (up to the 5th harmonic) Spurious-Free Dynamic Range Channel-to-Channel Crosstalk Small-Signal Bandwidth Full-Power Bandwidth SINAD THD SFDR VCH_ = 2.048Vp-p, 25kHz (Note 4) -3dB rolloff 49 -70 68 -75 1.5 800 dB dB dB dB MHz kHz TUE INL DNL VDD = 2.7V to 3.6V VDD = 5.5V (Note 2) No missing codes over temperature VDD = 2.7V to 3.6V VDD = 5.5V (Note 2) Internal or external reference External reference, 2.048V 0.8 0.3 0.1 1 0.35 0.5 1 8 0.15 0.2 1 1 0.5 Bits LSB LSB LSB LSB ppm/C LSB LSB SYMBOL CONDITIONS MIN TYP MAX UNITS
2
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
ELECTRICAL CHARACTERISTICS (continued)
(VDD = +2.7V to +5.5V; unipolar input mode; COM = 0V; fSCLK = 500kHz, external clock (50% duty cycle); 10 clocks/conversion cycle (50ksps); 1F capacitor at REFOUT; TA = TMIN to TMAX; unless otherwise noted.) PARAMETER CONVERSION RATE Conversion Time (Note 5) Track/Hold Acquisition Time Aperture Delay Aperture Jitter Internal Clock Frequency External Clock-Frequency Range ANALOG INPUT Unipolar input, COM = 0V Input Voltage Range, SingleEnded and Differential (Note 7) Multiplexer Leakage Current Input Capacitance INTERNAL REFERENCE REFOUT Voltage REFOUT Short-Circuit Current REFOUT Temperature Coefficient Load Regulation (Note 8) Capacitive Bypass at REFOUT EXTERNAL REFERENCE AT REFIN Input Voltage Range Input Current POWER REQUIREMENTS Supply Voltage VDD VDD = 2.7V to 3.6V Full-scale input CLOAD = 10pF Supply Current (Note 2) IDD VDD = 5.5V Full-scale input CLOAD = 10pF Power-down Power-Supply Rejection (Note 10) PSR Operating mode Reference disabled Operating mode Reference disabled Software SHDN at DGND 2.7 85 45 120 80 2 3.2 0.4 10 4 mV 250 A 5.5 250 V (Note 9) 1 1 VDD + 50mV 20 V A 0mA to 0.5mA output load 1 1.968 2.048 3.5 50 2.5 2.128 V mA ppm/C mV F Bipolar input, COM = VREFIN / 2 On/off-leakage current, VCH_ = 0V or VDD 0 VREFIN COM VREFIN / 2 0.01 18 1 V V A pF (Note 6) Used for data transfer only 50 tCONV tACQ Internal clock External clock, 500kHz, 10 clocks/conversion External clock, 2MHz 20 1 10 <50 400 500 2 25 55 s s ns ps kHz kHz MHz SYMBOL CONDITIONS MIN TYP MAX UNITS
VDD = 2.7V to 3.6V; external reference, 2.048V; full-scale input
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
ELECTRICAL CHARACTERISTICS (continued)
(VDD = +2.7V to +5.5V; unipolar input mode; COM = 0V; fSCLK = 500kHz, external clock (50% duty cycle); 10 clocks/conversion cycle (50ksps); 1F capacitor at REFOUT; TA = TMIN to TMAX; unless otherwise noted.) PARAMETER DIGITAL INPUTS: DIN, SCLK, CS DIN, SCLK, CS Input High Voltage DIN, SCLK, CS Input Low Voltage DIN, SCLK, CS Input Hysteresis DIN, SCLK, CS Input Leakage DIN, SCLK, CS Input Capacitance SHDN INPUT SHDN Input High Voltage SHDN Input Mid-Voltage SHDN Voltage, Floating SHDN Input Low Voltage SHDN Input Current SHDN Maximum Allowed Leakage for Mid-Input DIGITAL OUTPUTS: DOUT, SSTRB Output Low Voltage Output High Voltage Three-State Leakage Current Three-State Output Capacitance VOL VOH IL COUT ISINK = 5mA ISINK = 16mA ISOURCE = 0.5mA CS = VDD CS = VDD (Note 6) VDD - 0.5 0.01 10 15 0.4 0.8 V V A pF VSH VSM VFLT VSL SHDN = 0V or VDD SHDN = open SHDN = open VDD - 0.4 1.1 VDD / 2 0.4 4 100 VDD - 1.1 V V V V A nA VIH VIL VHYST IIN CIN Digital inputs = 0V or VDD (Note 6) 0.2 1 15 VDD 3.6V VDD > 3.6V 2 3 0.8 V V V A pF SYMBOL CONDITIONS MIN TYP MAX UNITS
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
TIMING CHARACTERISTICS (Figures 8 and 9)
(VDD = +2.7V to +5.5V, TA = TMIN to TMAX, unless otherwise noted.) PARAMETER Track/Hold Acquisition Time DIN to SCLK Setup DIN to SCLK Hold SCLK Fall to Output Data Valid CS Fall to Output Enable CS Rise to Output Disable CS to SCLK Rise Setup CS to SCLK Rise Hold SCLK Pulse Width High SCLK Pulse Width Low SCLK Fall to SSTRB CS Fall to SSTRB Output Enable (Note 6) CS Rise to SSTRB Output Disable (Note 6) SSTRB Rise to SCLK Rise (Note 6) Wake-Up Time SYMBOL tACQ tDS tDH tDO tDV tTR tCSS tCSH tCH tCL tSSTRB tSDV tSTR tSCK tWAKE CLOAD = 100pF Figure 1, external clock mode only, CLOAD = 100pF Figure 2, external clock mode only, CLOAD = 100pF Figure 11, internal clock mode only External reference Internal reference (Note 11) 0 20 12 Figure 1, CLOAD = 100pF MAX111_C/E MAX111_M CONDITIONS MIN 1 100 0 20 20 200 240 240 240 100 0 200 200 240 240 240 TYP MAX UNITS s ns ns ns ns ns ns ns ns ns ns ns ns ns s ms
Figure 1, CLOAD = 100pF Figure 2, CLOAD = 100pF
Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: Note 7: Note 8: Note 9: Note 10: Note 11:
Relative accuracy is the analog value's deviation (at any code) from its theoretical value after the full-scale range is calibrated. See Typical Operating Characteristics. VREFIN = 2.048V, offset nulled. On-channel grounded; sine wave applied to all off-channels. Conversion time is defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle. Guaranteed by design. Not subject to production testing. Common-mode range for the analog inputs is from AGND to VDD. External load should not change during the conversion for specified accuracy. External reference at 2.048V, full-scale input, 500kHz external clock. Measured as | VFS (2.7V) - VFS (3.6V) |. 1F at REFOUT; internal reference settling to 0.5LSB.
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
__________________________________________Typical Operating Characteristics
(VDD = +2.7V; fSCLK = 500kHz; external clock (50% duty cycle); RL = ; TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX1110-01
SUPPLY CURRENT vs. TEMPERATURE
OUTPUT CODE = FULL SCALE CLOAD = 10pF
MAX1110-02
SHUTDOWN SUPPLY CURRENT vs. TEMPERATURE
SHDN = DGND 4.5 4.0 3.5 3.0 2.5 2.0
MAX1110-03
400 OUTPUT CODE = 10101010 350 SUPPLY CURRENT (A) 300 250 CLOAD = 60pF 200 150 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5 CLOAD = 30pF
160
5.0 SHUTDOWN SUPPLY CURRENT (A)
140 SUPPLY CURRENT (A)
120
VDD = 5.5V
100
80
VDD = 3.6V
60 6.0 -60 -20 20 60 100 140 SUPPLY VOLTAGE (V) TEMPERATURE (C)
-60
-20
20
60
100
140
TEMPERATURE (C)
OFFSET ERROR vs. SUPPLY VOLTAGE
0.7 OFFSET ERROR (LSB) 0.6 INL (LSB) 0.5 0.4 0.3 0.2 0.1 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V) 0 2.5
MAX1110-04
INTEGRAL NONLINEARITY vs. SUPPLY VOLTAGE
MAX1110-05
DIFFERENTIAL NONLINEARITY vs. CODE
MAX1110-06
0.8
0.5
0.3 0.2 0.1 DNL (LSB)
0.4
0.3
0 -0.1
0.2
0.1
-0.2 -0.3 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 64 128 DIGITAL CODE 192 256 SUPPLY VOLTAGE (V)
OFFSET ERROR vs. TEMPERATURE
MAX1110-07
INTEGRAL NONLINEARITY vs. CODE
MAX1110-08
FFT PLOT
fCH_ = 10.034kHz, 2Vp-p fSAMPLE = 50ksps
MAX1110-09
0.6 0.5 OFFSET ERROR (LSB) 0.4
0.20 0.15 0.10 INL (LSB) 0.05 0 -0.05 -0.10
20 0 AMPLITUDE (dB) -20 -40 -60 -80 -100
0.3 0.2 0.1 0 -60 -20 20 60 100 140 TEMPERATURE (C)
-0.15 -0.20 0 64 128 DIGITAL CODE 192 256
0
5
10
15
20
25
FREQUENCY (kHz)
6
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs
______________________________________________________________Pin Description
PIN NAME MAX1110 1-4 5-8 9 MAX1111 1-4 -- 5 CH0-CH3 CH4-CH7 COM Sampling Analog Inputs Sampling Analog Inputs Ground Reference for Analog Inputs. Sets zero-code voltage in single-ended mode. Must be stable to 0.5LSB. Three-Level Shutdown Input. Normally floats. Pulling SHDN low shuts the MAX1110/ MAX1111 down to 10A (max) supply current; otherwise, the devices are fully operational. Pulling SHDN high shuts down the internal reference. Reference Voltage Input for Analog-to-Digital Conversion. Connect to REFOUT to use the internal reference. Internal Reference Generator Output. Bypass with a 1F capacitor to AGND. Analog Ground Digital Ground Serial-Data Output. Data is clocked out on SCLK's falling edge. High impedance when CS is high. Serial-Strobe Output. In internal clock mode, SSTRB goes low when the MAX1110/ MAX1111 begin the A/D conversion and goes high when the conversion is done. In external clock mode, SSTRB pulses high for two clock periods before the MSB is shifted out. High impedance when CS is high (external clock mode only). Serial-Data Input. Data is clocked in at SCLK's rising edge. The voltage at DIN may exceed VDD (up to 5.5V). Active-Low Chip Select. Data is not clocked into DIN unless CS is low. When CS is high, DOUT is high impedance. The voltage at CS may exceed VDD (up to 5.5V). Serial-Clock Input. Clocks data in and out of serial interface. In external clock mode, SCLK also sets the conversion speed (duty cycle must be 45% to 55%). The voltage at SCLK may exceed VDD (up to 5.5V). Positive Supply Voltage, +2.7V to +5.5V FUNCTION
MAX1110/MAX1111
10
6
SHDN
11 12 13 14 15
7 8 9 10 11
REFIN REFOUT AGND DGND DOUT
16
12
SSTRB
17 18
13 14
DIN CS
19 20
15 16
SCLK VDD
+3V
+3V
DOUT
DOUT
3k
3k DOUT DOUT
3k DGND a) High-Z to VOH and VOL to VOH
CLOAD
CLOAD DGND b) High-Z to VOL and VOH to VOL
3k DGND a) VOH to High-Z
CLOAD
CLOAD DGND b) VOL to High-Z
Figure 1. Load Circuits for Enable Time
Figure 2. Load Circuits for Disable Time
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
_______________Detailed Description
The MAX1110/MAX1111 analog-to-digital converters (ADCs) use a successive-approximation conversion technique and input track/hold (T/H) circuitry to convert an analog signal to an 8-bit digital output. A flexible serial interface provides easy interface to microprocessors (Ps). Figure 3 shows the Typical Operating Circuit. acquisition interval spans two SCLK cycles and ends on the falling SCLK edge after the last bit of the input control word has been entered. At the end of the acquisition interval, the T/H switch opens, retaining charge on CHOLD as a sample of the signal at IN+. The conversion interval begins with the input multiplexer switching CHOLD from the positive input (IN+) to the negative input (IN-). In single-ended mode, IN- is simply COM. This unbalances node ZERO at the input of the comparator. The capacitive DAC adjusts during the remainder of the conversion cycle to restore node ZERO to 0V within the limits of 8-bit resolution. This action is equivalent to transferring a charge of 18pF x (VIN+ - VIN-) from CHOLD to the binary-weighted capacitive DAC, which in turn forms a digital representation of the analog input signal.
Pseudo-Differential Input
The sampling architecture of the ADC's analog comparator is illustrated in Figure 4, the equivalent input circuit. In single-ended mode, IN+ is internally switched to the selected input channel, CH_, and IN- is switched to COM. In differential mode, IN+ and IN- are selected from the following pairs: CH0/CH1, CH2/CH3, CH4/CH5, and CH6/CH7. Configure the MAX1110 channels with Table 1 and the MAX1111 channels with Table 2. In differential mode, IN- and IN+ are internally switched to either of the analog inputs. This configuration is pseudo-differential to the effect that only the signal at IN+ is sampled. The return side (IN-) must remain stable within 0.5LSB (0.1LSB for best results) with respect to AGND during a conversion. To accomplish this, connect a 0.1F capacitor from IN- (the selected analog input) to AGND. During the acquisition interval, the channel selected as the positive input (IN+) charges capacitor CHOLD. The
Track/Hold
The T/H enters its tracking mode on the falling clock edge after the sixth bit of the 8-bit control byte has been shifted in. It enters its hold mode on the falling clock edge after the eighth bit of the control byte has been shifted in. If the converter is set up for singleended inputs, IN- is connected to COM, and the converter samples the "+" input; if it is set up for differential inputs, IN- connects to the "-" input, and the difference (IN+ - IN-) is sampled. At the end of the conversion, the positive input connects back to IN+, and C HOLD charges to the input signal.
+2.7V CAPACITIVE DAC CH0 ANALOG INPUTS CH7 VDD 0.1F AGND DGND COM 1F CH0 CH1 CH2 CH3 I/O SCK (SK) MOSI (SO) MISO (SI) VSS CH4* CH5* CH6* CH7* COM CSWITCH TRACK T/H SWITCH VDD REFIN CHOLD INPUT MUX - + 18pF 6.5k RIN HOLD AT THE SAMPLING INSTANT, THE MUX INPUT SWITCHES FROM THE SELECTED IN+ CHANNEL TO THE SELECTED IN- CHANNEL. COMPARATOR ZERO
CPU MAX1110 MAX1111
REFOUT REFIN 1F CS SCLK DIN DOUT SSTRB SHDN
SINGLE-ENDED MODE: IN+ = CHO-CH7, IN- = COM. DIFFERENTIAL MODE: IN+ AND IN- SELECTED FROM PAIRS OF CH0/CH1, CH2/CH3, CH4*/CH5*, CH6*/CH7*. *MAX1110 ONLY
Figure 3. Typical Operating Circuit
8
Figure 4. Equivalent Input Circuit
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
Table 1a. MAX1110 Channel Selection in Single-Ended Mode (SGL/DIF = 1)
SEL2 0 1 0 1 0 1 0 1 SEL1 0 0 0 0 1 1 1 1 SEL0 0 0 1 1 0 0 1 1 CH0 + + + + + + + + CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM - - - - - - - -
Table 1b. MAX1110 Channel Selection in Differential Mode (SGL/DIF = 0)
SEL2 0 0 0 0 1 1 1 1 SEL1 0 0 1 1 0 0 1 1 SEL0 0 1 0 1 0 1 0 1 - + - + - + - + CH0 + CH1 - + - + - + - CH2 CH3 CH4 CH5 CH6 CH7
Table 2a. MAX1111 Channel Selection in Single-Ended Mode (SGL/DIF = 1)
SEL2 0 1 0 1 SEL1 0 0 1 1 SEL0 X X X X CH0 + + + + CH1 CH2 CH3 COM - - - -
Table 2b. MAX1111 Channel Selection in Differential Mode (SGL/DIF = 0)
SEL2 0 0 1 1 SEL1 0 1 0 1 SEL0 X X X X - + - + CH0 + CH1 - + - CH2 CH3
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
The time required for the T/H to acquire an input signal is a function of how quickly its input capacitance is charged. If the input signal's source impedance is high, the acquisition time lengthens, and more time must be allowed between conversions. The acquisition time, tACQ, is the minimum time needed for the signal to be acquired. It is calculated by: tACQ = 6 x (RS + RIN) x 18pF where RIN = 6.5k, RS = the source impedance of the input signal, and tACQ is never less than 1s. Note that source impedances below 2.4k do not significantly affect the AC performance of the ADC. age. However, for accurate conversions near full scale, the inputs must not exceed VDD by more than 50mV or be lower than AGND by 50mV. If the analog input exceeds 50mV beyond the supplies, do not forward bias the protection diodes of off channels over 2mA. The MAX1110/MAX1111 can be configured for differential or single-ended inputs with bits 2 and 3 of the control byte (Table 3). In single-ended mode, the analog inputs are internally referenced to COM with a full-scale input range from COM to VREFIN + COM. For bipolar operation, set COM to VREFIN / 2. In differential mode, choosing unipolar mode sets the differential input range at 0V to VREFIN. In unipolar mode, the output code is invalid (code zero) when a negative differential input voltage is applied. Bipolar mode sets the differential input range to VREFIN / 2. Note that in this mode, the common-mode input range includes both supply rails. Refer to Table 4 for input voltage ranges.
Input Bandwidth
The ADC's input tracking circuitry has a 1.5MHz smallsignal bandwidth, so it is possible to digitize highspeed transient events and measure periodic signals with bandwidths exceeding the ADC's sampling rate by using undersampling techniques. To avoid highfrequency signals being aliased into the frequency band of interest, anti-alias filtering is recommended.
Analog Inputs
Internal protection diodes, which clamp the analog input to VDD and AGND, allow the channel input pins to swing from (AGND - 0.3V) to (VDD + 0.3V) without dam-
Quick Look
To quickly evaluate the MAX1110/MAX1111's analog performance, use the circuit of Figure 5. The MAX1110/MAX1111 require a control byte to be written to DIN before each conversion. Tying DIN to +3V feeds
Table 3. Control-Byte Format
BIT 7 (MSB) START BIT 7 (MSB) 6 5 4 3 BIT 6 SEL2 NAME START SEL2 SEL1 SEL0 UNI/BIP BIT 5 SEL1 BIT 4 SEL0 BIT 3 UNI/BIP BIT 2 SGL/DIF BIT 1 PD1 BIT 0 (LSB) PD0
DESCRIPTION The first logic "1" bit after CS goes low defines the beginning of the control byte. Select which of the input channels are to be used for the conversion (Tables 1 and 2). 1 = unipolar, 0 = bipolar. Selects unipolar or bipolar conversion mode. Select differential operation if bipolar mode is used. See Table 4. 1 = single ended, 0 = differential. Selects single-ended or differential conversions. In singleended mode, input signal voltages are referred to COM. In differential mode, the voltage difference between two channels is measured. See Tables 1 and 2. 1 = fully operational, 0 = power-down. Selects fully operational or power-down mode. 1 = external clock mode, 0 = internal clock mode. Selects external or internal clock mode.
2
SGL/DIF
1 0 (LSB)
PD1 PD0
10
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
Table 4. Full-Scale and Zero-Scale Voltages
UNIPOLAR MODE Full Scale VREFIN + COM Zero Scale COM Positive Full Scale +VREFIN / 2 + COM BIPOLAR MODE Zero Scale COM Negative Full Scale -VREFIN / 2 + COM
in control bytes of $FF (hex), which trigger singleended, unipolar conversions on CH7 (MAX1110) or CH3 (MAX1111) in external clock mode without powering down between conversions. In external clock mode, the SSTRB output pulses high for two clock periods before the most significant bit of the 8-bit conversion result is shifted out of DOUT. Varying the analog input alters the output code. A total of 10 clock cycles is required per conversion. All transitions of the SSTRB and DOUT outputs occur on SCLK's falling edge.
ister. After CS falls, the first arriving logic "1" bit at DIN defines the MSB of the control byte. Until this first start bit arrives, any number of logic "0" bits can be clocked into DIN with no effect. Table 3 shows the control-byte format. The MAX1110/MAX1111 are compatible with MICROWIRE, SPI, and QSPI devices. For SPI, select the correct clock polarity and sampling edge in the SPI control registers: set CPOL = 0 and CPHA = 0. MICROWIRE, SPI, and QSPI all transmit a byte and receive a byte at the same time. Using the Typical Operating Circuit (Figure 3), the simplest software interface requires three 8-bit transfers to perform a conversion (one 8-bit transfer to configure the ADC, and two more 8-bit transfers to clock out the 8-bit conversion result). Figure 6 shows the MAX1110/ MAX1111 common serial-interface connections.
How to Start a Conversion
A conversion is started by clocking a control byte into DIN. With CS low, each rising edge on SCLK clocks a bit from DIN into the MAX1110/MAX1111's internal shift reg-
VDD 0.1F DGND 1F
+3V
OSCILLOSCOPE
SCLK SSTRB DOUT*
0V TO +2.048V ANALOG 0.01F INPUT
MAX1110 MAX1111
CH7 (CH3)
AGND CS SCLK
COM
DIN SSTRB
+3V
500kHz OSCILLATOR
CH1
CH2
CH3
CH4
REFOUT REFIN C1 1F
DOUT SHDN N.C.
*FULL-SCALE ANALOG INPUT, CONVERSION RESULT = $FF (HEX) ( ) ARE FOR THE MAX1111.
Figure 5. Quick-Look Circuit
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
I/O SCK MISO +3V CS SCLK DOUT
Simple Software Interface Make sure the CPU's serial interface runs in master mode so the CPU generates the serial clock. Choose a clock frequency from 50kHz to 500kHz.
1) Set up the control byte for external clock mode and call it TB1. TB1 should be of the format 1XXXXX11 binary, where the Xs denote the particular channel and conversion mode selected. 2) Use a general-purpose I/O line on the CPU to pull CS low. 3) Transmit TB1 and, simultaneously, receive a byte and call it RB1. Ignore RB1. 4) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB2. 5) Transmit a byte of all zeros ($00 hex) and, simultaneously, receive byte RB3. 6) Pull CS high. Figure 7 shows the timing for this sequence. Bytes RB2 and RB3 contain the result of the conversion padded with two leading zeros and six trailing zeros. The total conversion time is a function of the serial-clock frequency and the amount of idle time between 8-bit transfers. Make sure that the total conversion time does not exceed 1ms, to avoid excessive T/H droop.
MAX1110 MAX1111
SS a) SPI CS SCK MISO +3V CS SCLK DOUT
SS b) QSPI I/O SK SI CS
MAX1110 MAX1111
SCLK DOUT
MAX1110 MAX1111
c) MICROWIRE
Figure 6. Common Serial-Interface Connections to the MAX1110/MAX1111
Digital Inputs CS, SCLK, and DIN can accept input signals up to 5.5V, regardless of the supply voltages. This allows the MAX1110/MAX1111 to accept digital inputs from both 3V and 5V systems.
CS tACQ SCLK DIN
START 1 4 SEL2 SEL1 SEL0 UNI/ BIP SGL/ PD1 DIF 8 12 16 20 24
PD0
SSTRB RB1 DOUT ACQUISITION 4s (fSCLK = 500kHz)
B7 B6
RB2
B5 B4 B3 B2 B1 B0
RB3 FILLED WITH ZEROS
A/D STATE
IDLE
CONVERSION
IDLE
Figure 7. Single-Conversion Timing, External Clock Mode, 24 Clocks
12 ______________________________________________________________________________________
+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs
Digital Output In unipolar input mode, the output is straight binary (Figure 15). For bipolar inputs, the output is two's-complement (Figure 16). Data is clocked out at SCLK's falling edge in MSB-first format.
conversion steps. SSTRB pulses high for two clock periods after the last bit of the control byte. Successiveapproximation bit decisions are made and appear at DOUT on each of the next eight SCLK falling edges (Figure 7). After the eight data bits are clocked out, subsequent clock pulses clock out zeros from the DOUT pin. SSTRB and DOUT go into a high-impedance state when CS goes high; after the next CS falling edge, SSTRB outputs a logic low. Figure 9 shows the SSTRB timing in external clock mode. The conversion must complete in 1ms, or droop on the sample-and-hold capacitors may degrade conversion results. Use internal clock mode if the serial-clock frequency is less than 50kHz, or if serial-clock interruptions could cause the conversion interval to exceed 1ms.
MAX1110/MAX1111
Clock Modes
The MAX1110/MAX1111 can use either an external serial clock or the internal clock to perform the successiveapproximation conversion. In both clock modes, the external clock shifts data in and out of the devices. Bit PD0 of the control byte programs the clock mode. Figures 8-11 show the timing characteristics common to both modes.
External Clock In external clock mode, the external clock not only shifts data in and out, it also drives the analog-to-digital
CS *** tCSH SCLK tDS tDH DIN tDV DOUT tDO *** *** tCSS tCL tCH ***
tCSH
tDO
tTR
Figure 8. Detailed Serial-Interface Timing
CS *** tSDV *** *** *** tSTR
SSTRB
tSSTRB
tSSTRB
SCLK
****
****
PD0 CLOCKED IN
Figure 9. External Clock Mode SSTRB Detailed Timing
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
CS
SCLK DIN SSTRB
1
2
3
4
5 UNI/ BIP
6
7
8
9
10
11
12
15
16
17
18
SEL2 SEL1 SEL0 START
SGL/ DIF PD1
PD0
tCONV DOUT CONVERSION 25s TYP
B7 B6 B1 B0
FILLED WITH ZEROS IDLE
A/D STATE
IDLE
tACQ 4s (fSCLK = 500kHz)
Figure 10. Internal Clock Mode Timing
CS tCSH SSTRB
tCONV tSCK
tCSS
tSSTRB
SCLK PD0 CLOCK IN NOTE: FOR BEST NOISE PERFORMANCE, KEEP SCLK LOW DURING CONVERSION.
Figure 11. Internal Clock Mode SSTRB Detailed Timing
Internal Clock Internal clock mode frees the P from the burden of running the SAR conversion clock. This allows the conversion results to be read back at the processor's convenience, at any clock rate up to 2MHz. SSTRB goes low at the start of the conversion and then goes high when the conversion is complete. SSTRB is low for 25s (typically), during which time SCLK should remain low for best noise performance. An internal register stores data when the conversion is in progress. SCLK clocks the data out of this register at any time after the conversion is complete. After SSTRB goes high, the second falling clock edge produces the MSB of the conversion at DOUT, followed by the
14
remaining bits in MSB-first format (Figure 10). CS does not need to be held low once a conversion is started. Pulling CS high prevents data from being clocked into the MAX1110/MAX1111 and three-states DOUT, but it does not adversely affect an internal clock-mode conversion already in progress. When internal clock mode is selected, SSTRB does not go into a high-impedance state when CS goes high. Figure 11 shows the SSTRB timing in internal clock mode. In this mode, data can be shifted in and out of the MAX1110/MAX1111 at clock rates up to 2MHz, provided that the minimum acquisition time, tACQ, is kept above 1s.
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
CS 1 SCLK DIN DOUT SSTRB S CONTROL BYTE 0 S B7 CONVERSION RESULT 0 CONTROL BYTE 1 B0 S B7 CONVERSION RESULT 1 CONTROL BYTE 2 B0 S B7 CONVERSION RESULT 2 CONTROL BYTE 3 8 10 1 8 10 1 8 10 1
Figure 12a. Continuous Conversions, External Clock Mode, 10 Clocks/Conversion Timing
CS
SCLK DIN DOUT S CONTROL BYTE 0 B7 CONVERSION RESULT 0 S B0 CONTROL BYTE 1 B7 CONVERSION RESULT 1
Figure 12b. Continuous Conversions, External Clock Mode, 16 Clocks/Conversion Timing
Data Framing
The falling edge of CS does not start a conversion. The first logic high clocked into DIN is interpreted as a start bit and defines the first bit of the control byte. A conversion starts on the falling edge of SCLK, after the eighth bit of the control byte (the PD0 bit) is clocked into DIN. The start bit is defined as: The first high bit clocked into DIN with CS low any time the converter is idle; e.g., after VDD is applied. OR The first high bit clocked into DIN after the MSB of a conversion in progress is clocked onto the DOUT pin.
If CS is toggled before the current conversion is complete, then the next high bit clocked into DIN is recognized as a start bit; the current conversion is terminated, and a new one is started. The fastest the MAX1110/MAX1111 can run is 10 clocks per conversion. Figure 12a shows the serialinterface timing necessary to perform a conversion every 10 SCLK cycles in external clock mode. Many microcontrollers require that conversions occur in multiples of eight SCLK clocks; 16 clocks per conversion is typically the fastest that a microcontroller can drive the MAX1110/MAX1111. Figure 12b shows the serial-interface timing necessary to perform a conversion every 16 SCLK cycles in external clock mode.
15
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
Applications Information
Power-On Reset
When power is first applied, and if SHDN is not pulled low, internal power-on reset circuitry activates the MAX1110/MAX1111 in internal clock mode. SSTRB is high on power-up and, if CS is low, the first logical 1 on DIN is interpreted as a start bit. Until a conversion takes place, DOUT shifts out zeros. No conversions should be performed until the reference voltage has stabilized (see Electrical Characteristics).
Power-Down
When operating at speeds below the maximum sampling rate, the MAX1110/MAX1111's automatic powerdown mode can save considerable power by placing the converters in a low-current shutdown state between conversions. Figure 13 shows the average supply current as a function of the sampling rate. Select power-down with PD1 of the DIN control byte with SHDN high or floating (Table 3). Pull SHDN low at any time to shut down the converters completely. SHDN overrides PD1 of the control byte. Figures 14a and 14b illustrate the various power-down sequences in both external and internal clock modes.
Hard-Wired Power-Down Pulling SHDN low places the converters in hard-wired power-down. Unlike software power-down, the conversion is not completed; it stops coincidentally with SHDN being brought low. SHDN also controls the state of the internal reference (Table 5). Letting SHDN float enables the internal 2.048V voltage reference. When returning to normal operation with SHDN floating, there is a tRC delay of approximately 1M x CLOAD, where CLOAD is the capacitive loading on the SHDN pin. Pulling SHDN high disables the internal reference, which saves power when using an external reference.
External Reference
An external reference between 1V and VDD should be connected directly at the REFIN terminal. The DC input impedance at REFIN is extremely high, consisting of leakage current only (typically 10nA). During a conversion, the reference must be able to deliver up to 20A average load current and have an output impedance of 1k or less at the conversion clock frequency. If the reference has higher output impedance or is noisy, bypass it close to the REFIN pin with a 0.1F capacitor. If an external reference is used with the MAX1110/ MAX1111, tie SHDN to VDD to disable the internal reference and decrease power consumption.
SUPPLY CURRENT (A)
Software Power-Down Software power-down is activated using bit PD1 of the control byte. When software power-down is asserted, the ADCs continue to operate in the last specified clock mode until the conversion is complete. The ADCs then power down into a low quiescent-current state. In internal clock mode, the interface remains active, and conversion results may be clocked out after the MAX1110/ MAX1111 have entered a software power-down. The first logical 1 on DIN is interpreted as a start bit, which powers up the MAX1110/MAX1111. If the DIN byte contains PD1 = 1, then the chip remains powered up. If PD1 = 0, power-down resumes after one conversion.
CLOAD = 60pF CODE = 10101010 100 CLOAD = 30pF CODE = 10101010 10 CLOAD = 30pF CODE = 11111111 VDD = VREFIN = 3V CLOAD AT DOUT AND SSTRB 1 0 10 20 30 40
Table 5. Hard-Wired Power-Down and Internal Reference State
SHDN STATE 1 Floating 0 DEVICE MODE Enabled Enabled Power-Down INTERNAL REFERENCE Disabled Enabled Disabled
50
SAMPLING RATE (ksps)
Figure 13. Average Supply Current vs. Sampling Rate
16
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MAX1110-fig13
1000
+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
CLOCK MODE SHDN
INTERNAL
EXTERNAL
EXTERNAL
SETS EXTERNAL CLOCK MODE DIN
SXXXXX11 SXXXXX01
SETS POWERDOWN MODE
SETS EXTERNAL CLOCK MODE
SXX XXX1 1
DOUT
DATA VALID
DATA VALID
DATA INVALID POWERDOWN POWERDOWN
MODE
POWERED UP
POWERED UP
POWERED UP
Figure 14a. Power-Down Modes, External Clock Timing Diagram
INTERNAL CLOCK MODE SETS INTERNAL CLOCK MODE DIN
SXXXXX10 SXXXXX00
SETS POWER-DOWN MODE
S
DOUT SSTRB
DATA VALID
DATA VALID
CONVERSION POWERED UP
CONVERSION POWER-DOWN POWERED UP
MODE
Figure 14b. Power-Down Modes, Internal Clock Timing Diagram
Internal Reference
To use the MAX1110/MAX1111 with the internal reference, connect REFIN to REFOUT. The full-scale range of the MAX1110/MAX1111 with the internal reference is typically 2.048V with unipolar inputs, and 1.024V with bipolar inputs. The internal reference should be bypassed to AGND with a 1F capacitor placed as close to the REFIN pin as possible.
Transfer Function
Table 4 shows the full-scale voltage ranges for unipolar and bipolar modes. Figure 15 depicts the nominal, unipolar I/O transfer function, and Figure 16 shows the bipolar I/O transfer function when using a 2.048V reference. Code transitions occur at integer LSB values. Output coding is binary, with 1LSB = 8mV (2.048V/256) for unipolar operation and 1LSB = 8mV [(2.048V/2 - -2.048V/2)/256] for bipolar operation.
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17
+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
OUTPUT CODE 11111111 11111110 11111101
FULL-SCALE TRANSITION
SUPPLIES
+3V
GND
FS = VREFIN + COM 1LSB = VREFIN 256 00000011 00000010 00000001 00000000 0 (COM) 1 2 3 INPUT VOLTAGE (LSB) FS FS - 1LSB
R* = 10
VDD
AGND
DGND
+3V
DGND
MAX1110 MAX1111
* OPTIONAL
DIGITAL CIRCUITRY
Figure 15. Unipolar Transfer Function
Figure 17. Power-Supply Grounding Connections
Layout, Grounding, and Bypassing
OUTPUT CODE 01111111 01111110 V +FS = REFIN + COM 2 VREFIN COM = 2 -VREFIN -FS = + COM 2 VREFIN 1LSB = 256
00000010 00000001 00000000 11111111 11111110 11111101
10000001 10000000 -FS COM INPUT VOLTAGE (LSB) 1 +FS - 2 LSB
For best performance, use printed circuit boards. Wirewrap boards are not recommended. Board layout should ensure that digital and analog signal lines are separated from each other. Do not run analog and digital (especially clock) lines parallel to one another, or digital lines underneath the ADC package. Figure 17 shows the recommended system ground connections. A single-point analog ground (star ground point) should be established at AGND, separate from the logic ground. Connect all other analog grounds and DGND to the star ground. No other digital system ground should be connected to this ground. The ground return to the power supply for the star ground should be low impedance and as short as possible for noise-free operation. High-frequency noise in the VDD power supply may affect the comparator in the ADC. Bypass the supply to the star ground with 0.1F and 1F capacitors close to the V DD pin of the MAX1110/MAX1111. Minimize capacitor lead lengths for best supply-noise rejection. If the +3V power supply is very noisy, a 10 resistor can be connected to form a lowpass filter.
Figure 16. Bipolar Transfer Function
18
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+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs
Pin Configurations
TOP VIEW
CH0 1 CH1 2 CH2 3 CH3 4 CH4 5 CH5 6 CH6 7 CH7 8 COM 9 SHDN 10 20 VDD 19 SCLK 18 CS 17 DIN CH0 1 CH1 2 CH2 3 CH3 4 COM 5 SHDN 6 REFIN 7 REFOUT 8 16 VDD 15 SCLK 14 CS
MAX1110/MAX1111
MAX1110
16 SSTRB 15 DOUT 14 DGND 13 AGND 12 REFOUT 11 REFIN
MAX1111
13 DIN 12 SSTRB 11 DOUT 10 DGND 9 AGND
DIP/QSOP
DIP/SSOP
Ordering Information (continued)
PART MAX1110EPP MAX1110EAP MAX1110MJP MAX1111CPE MAX1111CEE MAX1111EPE MAX1111EEE MAX1111MJE TEMP. RANGE -40C to +85C -40C to +85C -55C to +125C 0C to +70C 0C to +70C -40C to +85C -40C to +85C -55C to +125C PIN-PACKAGE 20 Plastic DIP 20 SSOP 20 CERDIP** 16 Plastic DIP 16 QSOP 16 Plastic DIP 16 QSOP 16 CERDIP**
Chip Information
TRANSISTOR COUNT: 1996 SUBSTRATE CONNECTED TO DGND
**Contact factory for availability.
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19
+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs MAX1110/MAX1111
________________________________________________________Package Information
QSOP.EPS
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 1998 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
SSOP.EPS

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